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MC10E196, MC100E196 5V ECL Programmable Delay Chip
Description
The MC10E/100E196 is a programmable delay chip (PDC) designed primarily for very accurate differential ECL input edge placement applications. The delay section consists of a chain of gates and a linear ramp delay adjust organized as shown in the logic symbol. The first two delay elements feature gates that have been modified to have delays 1.25 and 1.5 times the basic gate delay of approximately 80 ps. These two elements provide the E196 with a digitally-selectable resolution of approximately 20 ps. The required device delay is selected by the seven address inputs D[0:6], which are latched on chip by a high signal on the latch enable (LEN) control. The FTUNE input takes an analog voltage and applies it to an internal linear ramp for reducing the 20 ps Least Significant Bit (LSB) minimum resolution still further. The FTUNE input is what differentiates the E196 from the E195. An eighth latched input, D7, is provided for cascading multiple PDC's for increased programmable range. The cascade logic allows full control of multiple PDC's, at the expense of only a single added line to the data bus for each additional PDC, without the need for any external gating. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. The 100 Series contains temperature compensation.
Features
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PLCC-28 FN SUFFIX CASE 776
MARKING DIAGRAM*
1
MCxxxE196FNG AWLYYWW
xxx A WL YY WW G
= 10 or 100 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
*For additional marking information, refer to Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.
* * * * * * * * *
2.0 ns Worst Case Delay Range 20 ps/Delay Step Resolution Linear Input for Tighter Resolution >1.0 GHz Bandwidth On Chip Cascade Circuitry PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = -4.2 V to -5.7 V Internal Input 50 kW Pulldown Resistors ESD Protection: Human Body Model; > 1 kV, Machine Model; > 75 V
* Meets or Exceeds JEDEC Spec EIA/JESD78 IC * * * *
Latchup Test Moisture Sensitivity Level: Pb = 1; Pb-Free = 3 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V-0 @ 1.125 in, Oxygen Index: 28 to 34 Transistor Count = 425 devices Pb-Free Packages are Available*
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
November, 2006 - Rev. 9
1
Publication Order Number: MC10E196/D
MC10E196, MC100E196
LOGIC DIAGRAM AND PINOUT ASSIGNMENT
D2
Table 1. PIN DESCRIPTION
PIN FUNCTION ECL Signal Input ECL Input Enable (H Forces Q Low) ECL MUX Select Inputs ECL Signal Output ECL Latch Enable ECL Min Delay Set ECL Max Delay Set ECL Cascade Signal ECL Linear Voltage Input Reference Voltage Output Positive Supply Negative Supply No Connect IN/IN EN D[0:7] Q/Q LEN SET MIN SET MAX CASCADE FTUNE VBB VCC, VCCO VEE NC
D3
24
D4
23
D5
22
D6
21
D7
20
NC
19 18 17 16
D1 D0 LEN
26 27 28 1 2 3 4
25
FTUNE NC VCC VCCO Q Q VCCO
VEE IN IN VBB
MC10E196 MC100E196
15 14 13 12
5
6
7
8
9
10
11
SET MAX
SET MIN
CASCADE
CASCADE
NC
NC EN
Table 2. TRUTH TABLE EN EN LEN LEN SETMIN SETMIN SETMAX SETMAX L H L H L H L H Q = IN Q Logic Low Pass Through D[0:10] Latch D[0:10] Normal Mode Min Delay Path Normal Mode Max Delay Path
FTUNE
* All VCC and VCCO pins are tied together on the die. Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation.
Figure 1. Pinout: PLCC-28 (Top View)
VBB
IN IN EN
1 1
0 1
0 1 * 1.5 1
0 1 1 1
0 1
4 GATES
0 1
8 GATES
0 1
16 GATES
0 1
0 1 1
Q Q
LINEAR RAMP
* 1.25
VEE
CASCADE 7 BIT LATCH
LEN LATCH D Q
LEN SET MIN SET MAX
CASCADE CASCADE
D0
D1
D2
D3
D4
D5
D6
D7
* delays are 25% or 50% longer than * standard (standard 80 ps)
Figure 2. Logic Diagram - Simplified
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MC10E196, MC100E196
Table 3. MAXIMUM RATINGS
Symbol VCC VEE VI Iout IBB TA Tstg qJA qJC VEE Tsol Parameter PECL Mode Power Supply NECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current VBB Sink/Source Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) PECL Operating Range NECL Operating Range Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board PLCC-28 PLCC-28 PLCC-28 Condition 1 VEE = 0 V VCC = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI VCC VI VEE Condition 2 Rating 8 -8 6 -6 50 100 0.5 0 to +85 -65 to +150 63.5 43.5 22 to 26 4.2 to 5.7 -5.7 to -4.2 265 265 Unit V V V V mA mA mA C C C/W C/W C/W V V C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
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MC10E196, MC100E196
Table 4. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 1)
0C Symbol IEE VOH VOL VIH VIL VBB VIHCMR IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 2) Output LOW Voltage (Note 2) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) Input HIGH Current Input LOW Current 0.5 0.3 3980 3050 3830 3050 3.62 2.2 Min Typ 130 4070 3210 3995 3285 Max 156 4160 3370 4160 3520 3.74 4.6 150 0.5 0.25 4020 3050 3870 3050 3.65 2.2 Min 25C Typ 130 4105 3210 4030 3285 Max 156 4190 3370 4190 3520 3.75 4.6 150 0.3 0.2 4090 3050 3940 3050 3.69 2.2 Min 85C Typ 130 4185 3227 4110 3302 Max 156 4280 3405 4280 3555 3.81 4.6 150 Unit mA mV mV mV mV V V mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary -0.46 V / +0.06 V. 2. Outputs are terminated through a 50 W resistor to VCC - 2.0 V. 3. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
Table 5. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = -5.0 V (Note 4)
0C Symbol IEE VOH VOL VIH VIL VBB VIHCMR IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 5) Output LOW Voltage (Note 5) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 6) Input HIGH Current Input LOW Current 0.5 0.3 -1020 -1950 -1170 -1950 -1.38 -2.8 Min Typ 130 -930 -1790 -1005 -1715 Max 156 -840 -1630 -840 -1480 -1.27 -0.4 150 0.5 0.065 -980 -1950 -1130 -1950 -1.35 -2.8 Min 25C Typ 130 -895 -1790 -970 -1715 Max 156 -810 -1630 -810 -1480 -1.25 -0.4 150 0.3 0.2 -910 -1950 -1060 -1950 -1.31 -2.8 Min 85C Typ 130 -815 -1773 -890 -1698 Max 156 -720 -1595 -720 -1445 -1.19 -0.4 150 Unit mA mV mV mV mV V V mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary -0.46 V / +0.06 V. 5. Outputs are terminated through a 50 W resistor to VCC - 2.0 V. 6. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
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MC10E196, MC100E196
Table 6. 100E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 7)
0C Symbol IEE VOH VOL VIH VIL VBB VIHCMR IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 8) Output LOW Voltage (Note 8) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 9) Input HIGH Current Input LOW Current 0.5 0.3 3975 3190 3835 3190 3.62 2.2 Min Typ 130 4050 3295 3975 3355 Max 156 4120 3380 4120 3525 3.74 4.6 150 0.5 0.25 3975 3190 3835 3190 3.62 2.2 Min 25C Typ 130 4050 3255 3975 3355 Max 156 4120 3380 4120 3525 3.74 4.6 150 0.5 0.2 3975 3190 3835 3190 3.62 2.2 Min 85C Typ 150 4050 3260 3975 3355 Max 179 4120 3380 4120 3525 3.74 4.6 150 Unit mA mV mV mV mV V V mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary -0.46 V / +0.8 V. 8. Outputs are terminated through a 50 W resistor to VCC - 2.0 V. 9. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
Table 7. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = -5.0 V (Note 10)
0C Symbol IEE VOH VOL VIH VIL VBB VIHCMR IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 11) Output LOW Voltage (Note 11) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 12) Input HIGH Current Input LOW Current 0.5 0.3 -1025 -1810 -1165 -1810 -1.38 -2.8 Min Typ 130 -950 -1705 -1025 -1645 Max 156 -880 -1620 -880 -1475 -1.26 -0.4 150 0.5 0.25 -1025 -1810 -1165 -1810 -1.38 -2.8 Min 25C Typ 130 -950 -1745 -1025 -1645 Max 156 -880 -1620 -880 -1475 -1.26 -0.4 150 0.5 0.2 -1025 -1810 -1165 -1810 -1.38 -2.8 Min 85C Typ 150 -950 -1740 -1025 -1645 Max 179 -880 -1620 -880 -1475 -1.26 -0.4 150 Unit mA mV mV mV mV V V mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. Input and output parameters vary 1:1 with VCC. VEE can vary -0.46 V / +0.8 V. 11. Outputs are terminated through a 50 W resistor to VCC - 2.0 V. 12. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC.
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MC10E196, MC100E196
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = -5.0 V (Note 13)
0C Symbol fMAX tPLH tPHL Characteristic Maximum Toggle Frequency Propagation Delay IN to Q; Tap = 0 IN to Q; Tap = 127 EN to Q; Tap = 0 D7 to CASCADE Programmable Range tPD (max) - tPD (min) Step Delay (Note 14) D0 High D1 High D2 High D3 High D4 High D5 High D6 High Linearity (Note 15) Duty Cycle Skew tPHL-tPLH (Note 16) Random Clock Jitter (RMS) Setup Time D to LEN D to IN (Note 17) EN to IN (Note 18) Hold Time LEN to D IN to EN (Note 19) Release Time EN to IN (Note 20) SET MAX to LEN SET MIN to LEN Random Clock Jitter (RMS) Output Rise/Fall Time 20-80% (Q) 20-80% (CASCADE) 125 300 200 800 200 500 0 300 800 800 <5 225 450 325 650 125 300 30 <5 0 200 800 200 500 0 300 800 800 <5 225 450 325 650 125 300 30 <5 0 200 800 200 500 0 300 800 800 <5 225 450 325 650 30 <5 0 ps ps 55 115 250 505 1000 D1 1210 3320 1250 300 2000 1360 3570 1450 450 2175 17 34 68 136 272 544 1088 D0 1510 3820 1650 700 1240 3380 1275 300 2050 Min Typ Max Min 25C Typ >1.0 1390 3630 1475 450 2240 17.5 35 70 140 280 560 1120 D0 1540 3880 1675 700 1440 3920 1350 300 2375 1590 4270 1650 450 2580 21 42 84 168 336 672 1344 D0 ps 1765 4720 1950 700 Max Min 85C Typ Max Unit GHz ps
tRANGE Dt
ps ps 120 205 380 740 1450
105 180 325 620 1190
55 115 250 515 1030 D1
105 180 325 620 1220
65 140 305 620 1240 D1
Lin tSKEW tJITTER ts
th
250
250
250
ps
tR
ps
tjit tr tf
ps ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 13. 10 Series: VEE can vary -0.46 V / +0.06 V. 100 Series: VEE can vary -0.46 V / +0.8 V. 14. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations of asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range. 15. The linearity specification guarantees to which delay control input the programmable steps will be monotonic (i.e. increasing delay steps for increasing binary counts on the control inputs Dn). Typically the device will be monotonic to the D0 input, however under worst case conditions and process variation, delays could decrease slightly with increasing binary counts when the D0 input is the LSB. With the D1 input as the LSB the device is guaranteed to be monotonic over all specified environmental conditions and process variation. 16. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output. 17. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set. 18. This setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than 75 mV to that IN/IN transition. 19. This hold time is the minimum time that EN must remain asserted after a negative going IN or positive going IN to prevent an output response greater than 75 mV to that IN/IN transition. 20. This release time is the minimum time that EN must be de-asserted prior to the next IN/IN transition to ensure an output response that meets the specified IN to Q propagation delay and transition times.
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MC10E196, MC100E196
ANALOG INPUT CHARACTERISTICS FTUNE = VCC to VEE
140 120 PROPAGATION DELAY (ps) 100 80 60 40 20 0 -4.5 -3.5 -2.5 -1.5 -0.5 PROPAGATION DELAY (ps) 100 90 80 70 60 50 40 30 20 10 0 -5 -4 -3 -2 FTUNE VOLTAGE (V) -1 0
FTUNE VOLTAGE (V)
Propagation Delay versus FTUNE Voltage (100E196)
Propagation Delay versus FTUNE Voltage (10E196)
USING THE FTUNE ANALOG INPUT The analog FTUNE pin on the E196 device is intended to add more delay in a tunable gate to enhance the 20 ps resolution capabilities of the fully digital E195. The level of resolution obtained is dependent on the number of increments applied to the appropriate range on the FTUNE pin. To provide this further level of resolution (See Logic Diagram), the FTUNE pin must be capable of adjusting the additional delay finer than the 20 ps digital resolution. From the provided graphs one sees that this requirement is easily achieved as over the entire FTUNE voltage range a 100 ps additional delay can be achieved. This extra analog range ensures that the FTUNE pin will be capable even under worst case conditions of covering the digital resolution. Typically the analog input will be driven by an external DAC to provide a digital control with very fine analog output steps. The final resolution of the device will be dependent on the width of the DAC chosen. To determine the voltage range necessary for the FTUNE input, the graphs provided should be used. As an example if a tuning range of 40 ps is selected to cover worst case conditions and ensure coverage of the digital range, from the 100E196 graph a voltage range of -3.25 V to -4.0 V would be necessary on the FTUNE pin. Obviously there are numerous voltage ranges which can be used to cover a given delay range, users are given the flexibility to determine which one best fits their designs.
Cascading Multiple E196's
To increase the programmable range of the E196 internal cascade circuitry has been included. This circuitry allows for the cascading of multiple E196's without the need for any external gating. Furthermore this capability requires only
one more address line per added E196. Obviously cascading multiple PDC's will result in a larger programmable range, however, this increase is at the expense of a longer minimum delay. Figure 3 illustrates the interconnect scheme for cascading two E196's. As can be seen, this scheme can easily be expanded for larger E196 chains. The D7 input of the E196 is the cascade control pin. With the interconnect scheme of Figure 3 when D7 is asserted it signals the need for a larger programmable range than is achievable with a single device. An expansion of the latch section of the block diagram is pictured below. Use of this diagram will simplify the explanation of how the cascade circuitry works. When D7 of chip #1 above is low the cascade output will also be low while the cascade bar output will be a logical high. In this condition the SET MIN pin of chip #2 will be asserted and thus all of the latches of chip #2 will be reset and the device will be set at its minimum delay. Since the RESET and SET inputs of the latches are overriding any changes on the A0-A6 address bus will not affect the operation of chip #2. Chip #1 on the other hand will have both SET MIN and SET MAX de-asserted so that its delay will be controlled entirely by the address bus A0-A6. If the delay needed is greater than can be achieved with 31.75 gate delays (1111111 on the A0-A6 address bus) D7 will be asserted to signal the need to cascade the delay to the next E196 device. When D7 is asserted the SET MIN pin of chip #2 will be de-asserted and the delay will be controlled by the A0-A6 address bus. Chip #1 on the other hand will have its SET MAX pin asserted resulting in the device delay to be independent of the A0-A6 address bus.
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MC10E196, MC100E196
When the SET MAX pin of chip #1 is asserted the D0 and D1 latches will be reset while the rest of the latches will be set. In addition, to maintain monotonicity an additional gate delay is selected in the cascade circuitry. As a result when D7 of chip #1 is asserted the delay increases from 31.75 gates to 32 gates. A 32 gate delay is the maximum delay setting for the E196. When cascading multiple PDC's it will prove more cost effective to use a single E196 for the Most Significant Bit (MSB) of the chain while using E195 for the lower order bits. This is due to the fact that only one fine tune input is needed to further reduce the delay step resolution.
ADDRESS BUS (A0-A6) A7
D2 D3 D4 D5 D6 D7 D2 D3 D4 D5 D6 D7 LINEAR INPUT
D1 D0 LEN VEE IN CASCADE
FTUNE
D1 D0 LEN VEE IN CASCADE IN SET MIN VBB EN
FTUNE
E196 Chip #1
VCC VCC0 Q CASCADE Q VCC0
E196 Chip #2
VCC VCC0 Q CASCADE Q VCC0 OUTPUT
INPUT
SET MAX
VBB EN
Figure 3. Cascading Interconnect Architecture
TO SELECT MULTIPLEXERS
BIT 0 D0 LEN Reset Reset SET MIN SET MAX Q0
BIT 1 D1 LEN Reset Reset Q1 D2
BIT 2 Q2
BIT 3 D3 LEN Reset Reset Q3 D4
BIT 4 Q4 D5
BIT 5 Q5
SET MAX
IN SET MIN
BIT 6 D6 LEN Reset Reset Q6
BIT 7 D7 LEN Reset Reset Q7 CASCADE CASCADE
LEN Reset Reset
LEN Reset Reset
LEN Reset Reset
Figure 4. Expansion of the Latch Section of the E196 Block Diagram
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MC10E196, MC100E196
30 PROPAGATION DELAY (ps) 25 DELAY VARIATION (ps) 20 15 10 5 0 -5 -10 -15 -5.5 -5.3 -5.1 -4.9 VEE, (V) -4.7 -4.5 -4.3 Note: All Taps Selected SET = H, Temp. = 0C 1600 1575 1550 1525 1500 1475 1450 1425 1400 1375 1350 1325 1300
0
10
20
30
40
50
60
70
80
90
100
Temperature (C)
Figure 5. Change in Delay vs. Change in Supply Voltage
Figure 6. Delay vs. Temperature (Fixed Path)
4400 4300 PROPAGATION DELAY (ps) 4200 4100 4000 3900 3800 3700 3600 3500 3400 0 10 20 30 40 50 60 70 80 90 100 1200 0 32 64 Tap Delay 96 128 PROPAGATION DELAY (ps) 3600 85C 2800 0C
2000
Temperature (C)
Figure 7. Delay vs. Temperature (Max. Delay).
Figure 8. 100E196 Temperature Effects on Delay.
3900 3400 DELAY (ps) 2900
88 PROPAGATION DELAY (ps) 84 80 76 72 68 64
2400 1900 1400
0
10
20
30
40
50
60
70
80
90
100
0
20
40
60
80
100
120
Temperature (C)
Tap Selection
Figure 9. Delay vs. Temperature (Per Gate).
Figure 10. E195 Delay Linearity.
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MC10E196, MC100E196
Q Driver Device Q Zo = 50 W 50 W 50 W D Zo = 50 W D Receiver Device
VTT VTT = VCC - 2.0 V
Figure 11. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device MC10E196FN MC10E196FNG MC10E196FNR2 MC10E196FNR2G MC100E196FN MC100E196FNG MC100E196FNR2 MC100E196FNR2G Package PLCC-28 PLCC-28 (Pb-Free) PLCC-28 PLCC-28 (Pb-Free) PLCC-28 PLCC-28 (Pb-Free) PLCC-28 PLCC-28 (Pb-Free) Shipping 37 Units / Rail 37 Units / Rail 500 / Tape & Reel 500 / Tape & Reel 37 Units / Rail 37 Units / Rail 500 / Tape & Reel 500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices
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MC10E196, MC100E196
PACKAGE DIMENSIONS
PLCC-28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE E
Y BRK D Z -L- -M- B 0.007 (0.180) U
M
T L-M
M
S
N
S S
-N-
0.007 (0.180)
T L-M
N
S
W
28 1
D
V
X VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R E G G1 0.010 (0.250)
S
0.007 (0.180) 0.007 (0.180)
M M
T L-M T L-M
S S
N N
S S
H
0.007 (0.180)
M
T L-M
S
N
S
C
K1 0.004 (0.100) -T- SEATING
PLANE
J
K F VIEW S 0.007 (0.180)
M
VIEW S T L-M
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10_ 0.410 0.430 0.040 ---
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10_ 10.42 10.92 1.02 ---
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MC10E196, MC100E196
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC10E196/D

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